The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
Jul. 08, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a lower substrate including a lower passivation layer, a lower pad, element pads and a supporting pad that are disposed on a lower surface of the lower substrate. The lower passivation layer partially covers the lower pad, the element pads and the supporting pad. A semiconductor chip is disposed on an upper surface of the lower substrate. An upper substrate is disposed on the semiconductor chip and is connected to the lower substrate. An encapsulator is disposed between the lower substrate and the upper substrate. An element is disposed on the lower surface of the lower substrate. The element is bonded to the element pads. A lower supporting member is disposed on the lower surface of the lower substrate. A supporting bonding member bonds the lower supporting member to the supporting pad.