The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Aug. 24, 2020
Applicant:

Schlumberger Technology Corporation, Sugar Land, TX (US);

Inventors:

Mark Alex Kostinovsky, Houston, TX (US);

Steven O. Dunford, Missouri City, TX (US);

Lweness Mazari, Sugar Land, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/43 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01L 24/89 (2013.01); H01L 2224/03019 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/08502 (2013.01); H01L 2224/11019 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16502 (2013.01); H01L 2224/4312 (2013.01); H01L 2224/43125 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45655 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48506 (2013.01); H01L 2224/80355 (2013.01); H01L 2224/81355 (2013.01); H01L 2224/85355 (2013.01); H01L 2924/15747 (2013.01);
Abstract

A method for interconnecting two conductors includes creating a first nickel layer on a first conductor of an electrical component, producing a first non-gold protective layer on the first nickel layer, the first non-gold protective layer being configured to prevent the first nickel layer from oxidizing, creating a second nickel layer on a second conductor, producing a second non-gold protective layer on the second nickel layer, the second non-gold protective layer being configured to prevent the second nickel layer from oxidizing, and interconnecting the first and second nickel layers using a solder layer that interfaces with the first and second nickel layers between the first and second conductors.


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