The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
May. 28, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jinduck Park, Asan-si, KR;
Chansik Kwon, Asan-si, KR;
Jongkeun Moon, Asan-si, KR;
Suyang Lee, Cheonan-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
Semiconductor packages may include a first semiconductor chip including a first through-electrode and a first upper connection pad and on an upper surface of the first semiconductor chip, a second semiconductor chip on the first semiconductor chip and including a second lower connection pad on a lower surface of the second semiconductor chip, a connection bump between the first and second semiconductor chips and connected to the first upper connection pad and the second lower connection pad, a first insulating layer between the first and second semiconductor chips and surrounding the first upper connection pad, the connection bump, and the second lower connection pad, and a second insulating layer between the first semiconductor chip and the first insulating layer and extending on the upper surface of the first semiconductor chip, a side surface of the first upper connection pad, and a portion of a side surface of the connection bump.