The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

May. 27, 2020
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Daisuke Kori, Joetsu, JP;

Takashi Sawamura, Joetsu, JP;

Keisuke Niida, Joetsu, JP;

Seiichiro Tachibana, Joetsu, JP;

Takeru Watanabe, Joetsu, JP;

Tsutomu Ogihara, Joetsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/027 (2006.01); H01L 21/033 (2006.01); G03F 7/09 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0271 (2013.01); G03F 7/091 (2013.01); G03F 7/094 (2013.01); H01L 21/033 (2013.01);
Abstract

A material for forming an organic film using a polymer including an imide group for forming an organic underlayer film that cures under film-forming conditions in the air and in an inert gas, generates no by-product in heat resistance and embedding and flattening characteristics of a pattern formed on a substrate, also adhesiveness to a substrate for manufacturing a semiconductor apparatus, a method for forming an organic film, and a patterning process. The material includes (A) a polymer having a repeating unit represented by the following general formula (1A) whose terminal group is a group represented by either of the following general formulae (1B) or (1C), and (B) an organic solvent: wherein, Wrepresents a tetravalent organic group, and Wrepresents a divalent organic group: wherein, Rrepresents any of the groups represented by the following formula (1D), and two or more of Rs may be used in combination.


Find Patent Forward Citations

Loading…