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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11676757 B1

PDFFull Text
Date of Patent:
Jun. 13, 2023

Filed:

Jul. 15, 2020

Electronic component and method of manufacturing electronic component

Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Shinji Otani, Nagaokakyo, JP;

Yuuta Hoshino, Nagaokakyo, JP;

Toshihiko Kobayashi, Nagaokakyo, JP;

Tomotaka Gotohda, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Ronald Hinson

Int. Cl.
CPC ...
H01F 17/04 (2006.01); H01F 27/32 (2006.01); H01F 27/28 (2006.01); H01F 41/061 (2016.01); H01F 27/29 (2006.01); H01F 41/12 (2006.01); H01F 27/24 (2006.01);
U.S. Cl.
CPC ...
H01F 27/32 (2013.01); H01F 27/24 (2013.01); H01F 27/2823 (2013.01); H01F 27/29 (2013.01); H01F 41/061 (2016.01); H01F 41/12 (2013.01);
Abstract

An insulating layer, which is composed of a material having a higher insulating property than a core, partially covers a surface of the core. A plating layer, which functions as an electrode, is stacked on a surface of the insulating layer. The surface area of the insulating layer is larger than the surface area of the plating layer and the plating layer is stacked inside a region covered by the insulating layer.

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Otani, Shinji. (2023). Electronic component and method of manufacturing electronic component (U.S. Patent No. 11676757). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11676757

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