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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11676753 B1

PDFFull Text
Date of Patent:
Jun. 13, 2023

Filed:

Jul. 30, 2020

Coil component

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Ji Hoon Hwang, Suwon-si, KR;

Myoung Ki Shin, Suwon-si, KR;

Jeong Gu Yeo, Suwon-si, KR;

Young Il Lee, Suwon-si, KR;

Byeong Cheol Moon, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Mohamad A Musleh

Assistant Examiner:

Malcolm Barnes

Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/292 (2013.01); H01F 27/324 (2013.01); H01F 2017/048 (2013.01);
Abstract

A coil component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a magnetic body, in which the support substrate and the coil portion are disposed, having a through-portion penetrating through a center of the coil portion, a nonmagnetic layer disposed below the through-portion, and an insulating layer disposed between the nonmagnetic layer and the through-portion.

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Quick Actions:

Hwang, Ji. (2023). Coil component (U.S. Patent No. 11676753). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11676753

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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