The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Mar. 11, 2022
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Robert G. Biskeborn, Hollister, CA (US);

Oscar J. Ruiz, San Jose, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/127 (2006.01);
U.S. Cl.
CPC ...
G11B 5/127 (2013.01);
Abstract

The present disclosure is generally related to a tape head comprising a first module and a second module joined together along a seam. The first module comprises a plurality of data heads disposed in a first row parallel to the seam, and the second module comprises a plurality of data heads disposed in a second row parallel to the first row. The first row and the second row are spaced apart a distance of about 50 μm to about 175 μm. A via is disposed at a media facing surface (MFS) along a portion of the seam. The via has a length less than a width of the MFS and equal to or greater than a length of the first and second rows of data heads. The via is configured to create a vacuum effect to pull a magnetic media against the media facing surface when the tape head reads and writes data to the magnetic media.


Find Patent Forward Citations

Biskeborn, Robert. (2023). Tape head having joined modules (U.S. Patent No. 11676626). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11676626

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…