The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Apr. 13, 2021
Applicant:

Amazon Technologies, Inc., Seattle, WA (US);

Inventors:

Christopher Wells Fitzhugh, San Jose, CA (US);

Li Huang, San Jose, CA (US);

Catherine May Farmer, San Francisco, CA (US);

Duc Hongle Ngo, Hayward, CA (US);

Eric Foxlin, Belmont, CA (US);

Gregory Turner Witmer, Los Gatos, CA (US);

Babak Hashemizadeh, Fremont, CA (US);

Marcel Colman Eric Stieber, Sunnyvale, CA (US);

Assignee:

AMAZON TECHNOLOGIES, INC., Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05D 1/00 (2006.01); G05D 1/02 (2020.01); B60R 16/06 (2006.01);
U.S. Cl.
CPC ...
G05D 1/0088 (2013.01); B60R 16/06 (2013.01); G05D 1/0253 (2013.01); G05D 1/0272 (2013.01);
Abstract

An autonomous mobile device (AMD) builds up electrostatic charges from moving and generates heat from the operation of internal components. In addition to possible user discomfort, electrostatic discharges may damage sensors and electronics. Electrostatic charges are dissipated from the AMD using an electrostatic dissipation structure and conductive wheels. A conductive path between a chassis ground, the electrostatic dissipation structure, and the conductive wheels improves the dissipation of electrostatic charges. Electrostatic charges are also dissipated from components by mounting the components using conductive materials. Sensors may be affixed to a support structure that is affected by thermal expansion. Thermal expansion may distort precise positioning of sensors, reducing accuracy of sensor data. An elastomeric foam may be used to mount sensors to a support structure, allowing for thermal expansion without distorting the positioning of the sensors.


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