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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11674208 B1

PDFFull Text
Date of Patent:
Jun. 13, 2023

Filed:

Mar. 23, 2020

High conductivity magnesium alloy

Applicant:

Terves, Llc, Euclid, OH (US);

Inventors:

Andrew J. Sherman, Mentor, OH (US);

Nicholas Farkas, Euclid, OH (US);

Assignee:

Terves, LLC, Euclid, OH (US);

Attorneys:

Ulmer & Berne LLP

Brian E Turung

Primary Examiner:

Lois L Zheng

Int. Cl.
CPC ...
C22C 23/00 (2006.01); C22F 1/06 (2006.01); C21D 10/00 (2006.01); B82Y 30/00 (2011.01); E02D 27/38 (2006.01); C22C 23/02 (2006.01); C22C 49/04 (2006.01); B22D 27/00 (2006.01); B22D 27/08 (2006.01); B22D 19/14 (2006.01); B22D 27/11 (2006.01); C22C 1/03 (2006.01); B22D 27/02 (2006.01); C22C 23/06 (2006.01); C22C 26/00 (2006.01); C22C 1/04 (2023.01); B22D 21/00 (2006.01); C22C 47/08 (2006.01); B22D 25/06 (2006.01); B22D 23/06 (2006.01); B22D 21/04 (2006.01); C22C 49/02 (2006.01); B22F 1/062 (2022.01); C22C 1/10 (2023.01);
U.S. Cl.
CPC ...
C22F 1/06 (2013.01); B22D 19/14 (2013.01); B22D 21/007 (2013.01); B22D 21/04 (2013.01); B22D 23/06 (2013.01); B22D 25/06 (2013.01); B22D 27/00 (2013.01); B22D 27/02 (2013.01); B22D 27/08 (2013.01); B22D 27/11 (2013.01); B82Y 30/00 (2013.01); C21D 10/00 (2013.01); C22C 1/03 (2013.01); C22C 1/0408 (2013.01); C22C 23/00 (2013.01); C22C 23/02 (2013.01); C22C 23/06 (2013.01); C22C 26/00 (2013.01); C22C 47/08 (2013.01); C22C 49/04 (2013.01); E02D 27/38 (2013.01); B22F 1/062 (2022.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C22C 1/1047 (2023.01); C22C 49/02 (2013.01); C22C 2026/002 (2013.01);
Abstract

A castable, moldable, or extrudable magnesium-based alloy that includes one or more insoluble additives. The insoluble additives can be used to enhance the mechanical properties of the structure, such as ductility and/or tensile strength. The final structure can be enhanced by heat treatment, as well as deformation processing such as extrusion, forging, or rolling, to further improve the strength of the final structure as compared to the non-enhanced structure. The magnesium-based composite has improved thermal and mechanical properties by the modification of grain boundary properties through the addition of insoluble nanoparticles to the magnesium alloys. The magnesium-based composite can have a thermal conductivity that is greater than 180 W/m-K, and/or ductility exceeding 15-20% elongation to failure.

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