The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Aug. 06, 2019
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Ki Seung Seo, Daejeon, KR;

Ji Hye Kim, Daejeon, KR;

Sang Hwan Kim, Daejeon, KR;

Jun Hyoung Park, Daejeon, KR;

Kyung Jun Yoon, Daejeon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 133/08 (2006.01); C09J 7/40 (2018.01); C09J 133/10 (2006.01); C09J 133/14 (2006.01);
U.S. Cl.
CPC ...
C09J 133/08 (2013.01); C09J 7/405 (2018.01); C09J 133/10 (2013.01); C09J 133/14 (2013.01); C09J 2203/318 (2013.01); C09J 2203/326 (2013.01); C09J 2301/122 (2020.08); C09J 2301/308 (2020.08); C09J 2433/00 (2013.01); C09J 2483/005 (2013.01); Y10T 428/2891 (2015.01);
Abstract

A substrate-free adhesive tape that is excellent in adhesive physical properties and is suitable for a continuous process is provided. The substrate-free adhesive tape includes a release film, and an adhesive layer provided on one surface of the release film and the adhesive layer containing a cured product of an adhesive composition, wherein when the release film is fixed on the outer surface of a semicircular tip part of a jig, the semicircular tip part having a radius of 22.5 mm, a breaking distance of the adhesive layer is 110 mm or less when the adhesive layer is stretched at a rate of 20 m/min from a semicircular center of the semicircular tip part toward an outermost direction of the semicircular tip part.


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