The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Jul. 11, 2018
Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventor:

Kenji Ota, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); C08K 3/22 (2006.01); H01M 10/613 (2014.01); H01M 10/655 (2014.01); C09K 5/14 (2006.01); H05K 7/20 (2006.01); C08K 3/04 (2006.01); C08K 5/5415 (2006.01); C08K 9/06 (2006.01); C08K 3/38 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C08K 3/04 (2013.01); C08K 3/22 (2013.01); C08K 5/5415 (2013.01); C08K 9/06 (2013.01); C09K 5/14 (2013.01); H01M 10/613 (2015.04); H01M 10/655 (2015.04); H05K 7/2039 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08K 2003/385 (2013.01); C08L 2201/08 (2013.01); C08L 2205/025 (2013.01);
Abstract

Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and has excellent gap-filling ability and repairability; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) a straight-chain organohydrogenpolysiloxane containing an average of 2 to 4 silicon-bonded hydrogen atoms per molecule, at least two of the hydrogen atoms are being located on a side chain of the molecular chain, wherein the amount of silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 mol with respected to 1 mol of an alkenyl group contained in component (A); (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; and (E) an alkoxysilane having an alkyl group with 6 or more carbon atoms per molecule.


Find Patent Forward Citations

Loading…