The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
Jun. 29, 2022
Applicant:
Chanda Chemical Corp., Taipei, TW;
Inventors:
Chien-Hsin Wu, Taipei, TW;
Ying-Chi Huang, Taipei, TW;
Sheng-hong A. Dai, Taipei, TW;
Ru-Jong Jeng, Taipei, TW;
Assignee:
CHANDA CHEMICAL CORP., Taipei, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 18/64 (2006.01); C08G 18/10 (2006.01); C08G 18/32 (2006.01); C08G 18/42 (2006.01); C08G 18/48 (2006.01); C08G 18/75 (2006.01); C08G 18/76 (2006.01); C08G 18/40 (2006.01); C08G 18/44 (2006.01); C08G 18/61 (2006.01); C08G 18/73 (2006.01);
U.S. Cl.
CPC ...
C08G 18/6469 (2013.01); C08G 18/10 (2013.01); C08G 18/3206 (2013.01); C08G 18/4277 (2013.01); C08G 18/4825 (2013.01); C08G 18/4833 (2013.01); C08G 18/4854 (2013.01); C08G 18/755 (2013.01); C08G 18/7671 (2013.01);
Abstract
A thermal plastic polyurethane with a stress more than 2.5 MPa, its preparing formulation and making process are disclosed. In particular, the thermal plastic polyurethane with a stress more than 2.5 MPa is prepared from a formulation comprises a polycarbonate derivative and a chain extender.
Quick Actions:
Wu, Chien-Hsin. (2023). High stress thermal plastic polyurethane, its preparing formulation and making process (U.S. Patent No. 11673991). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11673991
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile