The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Jan. 22, 2021
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Enri Duqi, Milan, IT;

Nicolo′ Boni, Albino, IT;

Lorenzo Baldo, Bareggio, IT;

Massimiliano Merli, Pavia, IT;

Roberto Carminati, Piancogno, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); H01L 41/35 (2013.01);
U.S. Cl.
CPC ...
B81C 1/00158 (2013.01); H01L 41/35 (2013.01); B81C 2201/013 (2013.01);
Abstract

To manufacture an oscillating structure, a wafer is processed by: forming torsional elastic elements; forming a mobile element connected to the torsional elastic elements; processing the first side of the wafer to form a mechanical reinforcement structure; and processing the second side of said wafer by steps of chemical etching, deposition of metal material, and/or deposition of piezoelectric material. Processing of the first side of the wafer is carried out prior to processing of the second side of the wafer so as not to damage possible sensitive structures formed on the first side of the wafer.


Find Patent Forward Citations

Loading…