The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
May. 10, 2018
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Kazuki Noma, Tokyo, JP;
Masayuki Yamashita, Tokyo, JP;
Masayuki Kanemasu, Tokyo, JP;
Mikoto Omori, Tokyo, JP;
Hiromichi Akiyama, Tokyo, JP;
Toshio Kozasa, Tokyo, JP;
Shunichi Morishima, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
A method is for manufacturing a honeycomb structure including a core material in which a hole is formed to penetrate in a thickness direction and is arranged in a plane direction, and a skin material that is stacked on a surface of the core material. The skin material includes a thermosetting resin. The method includes half-curing the thermosetting resin by placing the skin material in a bag and heating the skin material in a state where an inside of the bag is evacuated and an outside of the bag is under an atmospheric pressure; stacking the skin material in which the thermosetting resin is half-cured onto a side of the surface of the core material; and bonding and integrating the core material and the skin material with each other by pressurizing and heating the stacked core material and skin material with the use of a sealing pressurizing heating facility.