The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Feb. 15, 2019
Applicant:

Mitsui Chemicals, Inc., Tokyo, JP;

Inventors:

Kohei Nishino, Ichihara, JP;

Yohei Hotani, Shanghai, CN;

Isao Washio, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/16 (2006.01); C08K 3/013 (2018.01); B29C 65/00 (2006.01); B32B 27/08 (2006.01); B32B 27/34 (2006.01); C08G 69/26 (2006.01); C08K 7/14 (2006.01); C08L 77/06 (2006.01);
U.S. Cl.
CPC ...
B29C 65/1635 (2013.01); B29C 66/1122 (2013.01); B29C 66/71 (2013.01); B32B 27/08 (2013.01); B32B 27/34 (2013.01); C08G 69/265 (2013.01); C08K 3/013 (2018.01); C08K 7/14 (2013.01); C08L 77/06 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); C08L 2205/025 (2013.01);
Abstract

This polyamide resin composition contains: 30-89.9 parts by mass of a polyamide resin (A) having a melting point of at least 300° C.; 0-45 parts by mass of a polyamide resin (B) having substantially no melting point; 0.1-5 parts by mass of a light-transmitting pigment (C); and 10-55 parts by mass of a fibrous filler (D) (the total amount of (A), (B), (C), and (D) is 100 parts by mass). The polyamide resin (A) contains at least a terephthalic acid-derived component unit. In a molded body of the polyamide resin composition, the corrected heat of fusion (ΔHR) is 10-70 J/g, and the transmittance of laser light having a wavelength of 940 nm is at least 15% at a thickness of 1.6 mm.


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