The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Nov. 23, 2021
Applicant:

Honda Motor Co., Ltd., Tokyo, JP;

Inventors:

Tatsuya Okunaka, Wako, JP;

Haruka Ito, Wako, JP;

Fumitomo Takano, Wako, JP;

Mai Yokoi, Wako, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B29C 64/118 (2017.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B29C 64/364 (2017.01); B29C 64/20 (2017.01); B33Y 40/00 (2020.01); B29C 64/25 (2017.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B29C 64/118 (2017.08); B29C 64/364 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B29C 64/20 (2017.08); B29C 64/25 (2017.08); B33Y 40/00 (2014.12);
Abstract

In a three dimensional shaping method and a three dimensional shaping apparatus, when a three dimensional object is obtained by laminating a resin material having thermoplasticity, the resin material is melted, and the melted resin material is laminated in a chamber to form resin layers. Next, the pressure in the chamber is adjusted to maintain the temperature of each of the resin layers within a predetermined temperature range in the chamber.


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