The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Jan. 23, 2021
Applicant:

Impossible Objects, Inc., Northbrook, IL (US);

Inventors:

Robert Swartz, Highland Park, IL (US);

Leonard Wanger, Chicago, IL (US);

John Bayldon, Evanston, IL (US);

Jeffrey Saltzman, Northbrook, IL (US);

Charles Pint, Evanston, IL (US);

Eugene Gore, Des Plaines, IL (US);

Gintaras Vaisnys, Chicago, IL (US);

Giovanni Meier, Madison, CT (US);

Alon Henson, Highland Park, IL (US);

Assignee:

Impossible Objects, Inc., Northbrook, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); G06T 7/00 (2017.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); G06T 7/001 (2013.01); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); G06T 2207/30144 (2013.01);
Abstract

A collection of camera-based monitoring sub-systems can be added to a composite-based additive manufacturing (CBAM) system to autonomously inspect the integrity of each layer and remediate issues in real time. Cameras are located at various stations throughout the process. Resulting images are analyzed to see if processed pages are within tolerance based on comparison with models. Cameras can be placed at the print platen, on a rear conveyor that conveys powdered pages to the stacker and in the stacker itself to make sure pages are stacked and aligned properly. The present invention provides quality assurance and quality control to validate the build process at the layer level. This reduces the amount of post-build labor to perform, and since it shows data internal to the part, it dramatically reduces the amount of destructive testing required.


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