The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
Apr. 28, 2017
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Vladek Kasperchik, Corvallis, OR (US);
Michael G. Monroe, Corvallis, OR (US);
Johnathon Holroyd, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 10/00 (2015.01); B33Y 40/10 (2020.01); B33Y 70/10 (2020.01); B22F 1/102 (2022.01); B33Y 70/00 (2020.01); B22F 10/16 (2021.01); B29C 64/314 (2017.01); B33Y 30/00 (2015.01); B29C 64/165 (2017.01); B22F 1/17 (2022.01); B33Y 50/02 (2015.01); B29C 64/393 (2017.01); B22F 10/85 (2021.01); B22F 12/10 (2021.01);
U.S. Cl.
CPC ...
B29C 64/314 (2017.08); B22F 1/102 (2022.01); B22F 1/17 (2022.01); B22F 10/16 (2021.01); B29C 64/165 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/10 (2020.01); B33Y 70/00 (2014.12); B33Y 70/10 (2020.01); B22F 10/85 (2021.01); B22F 12/10 (2021.01); B22F 2304/10 (2013.01); B29C 64/393 (2017.08); B33Y 50/02 (2014.12);
Abstract
A metallic build material granule includes a plurality of primary metal particles and a temporary binder agglomerating the plurality of primary metal particles together. The primary metal particles have a primary metal particle size ranging from about the 1 μm to about 20 μm. The primary metal particles are non-shape memory metal particles, and the metallic build material granule excludes shape memory metal particles.