The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
Feb. 18, 2020
University of Science and Technology Beijing;
Lin Zhang, Beijing, CN;
Xuanhui Qu, Beijing, CN;
Xingyu Li, Beijing, CN;
Mingli Qin, Beijing, CN;
Yanhao Dong, Beijing, CN;
Ju Li, Beijing, CN;
Guanghua Wang, Beijing, CN;
Ying Long, Beijing, CN;
Wei Zhong, Beijing, CN;
UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING, Beijing, CN;
Abstract
A method to achieve full densification and grain size control for sintering metal materials, wherein raw material powder is deagglomerated to obtain deagglomerated powder with dispersion. The deagglomerated powder is granulated by spray granulation. The granulated particles are processed by high-pressure die pressing and cold isostatic pressing. The powder compact is sintered by two-step pressureless sintering. The first step is to heat up the powder compact to a higher temperature and hold for a short time to obtain 75-85% theoretical density; the second step is to cool down powder compact to a lower temperature and hold for a long time. The two-step sintering can decrease the sintering temperature, so that the powder compact can be densified at a lower temperature. Thus, the obtained refractory metal product is densified, with ultrafine grains, uniform grain size distribution, and outstanding mechanical properties.