The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Oct. 28, 2019
Applicant:
Bfly Operations, Inc., Guilford, CT (US);
Inventors:
Jonathan M. Rothberg, Guilford, CT (US);
Susan A. Alie, Stoneham, MA (US);
Jaime Scott Zahorian, Guilford, CT (US);
Paul Francis Cristman, New Haven, CT (US);
Keith G. Fife, Palo Alto, CA (US);
Assignee:
BFLY OPERATIONS, INC., Burlington, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H05K 13/04 (2006.01); H01L 41/27 (2013.01); B06B 1/02 (2006.01); B06B 1/06 (2006.01); H01L 41/047 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H01L 41/27 (2013.01); B06B 1/0292 (2013.01); B06B 1/06 (2013.01); H01L 41/047 (2013.01); H05K 3/361 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/0726 (2013.01);
Abstract
An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.