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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11672083 B1

PDFFull Text
Date of Patent:
Jun. 06, 2023

Filed:

Oct. 08, 2021

Method of manufacturing composite circuit board

Applicants:

Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Qinhuangdao, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Inventors:

Yang Li, Guangdong, CN;

Yan-Lu Li, Shenzhen, CN;

Assignees:

HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Qinhuangdao, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Attorney:

ScienBiziP, P.C.

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/02 (2006.01); H05K 3/06 (2006.01); H05K 3/10 (2006.01); H05K 3/14 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01); H05K 3/46 (2006.01); H01L 21/02 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 21/68 (2006.01); H01L 23/02 (2006.01); H01L 23/12 (2006.01); H01L 23/14 (2006.01); H01L 23/24 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H05K 3/32 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3452 (2013.01); H05K 3/0029 (2013.01); H05K 3/022 (2013.01); H05K 3/321 (2013.01); H05K 2203/0228 (2013.01);
Abstract

A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.

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