The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Jun. 30, 2022
Applicant:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Inventors:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/374 (2011.01); H01L 27/146 (2006.01); H04N 5/341 (2011.01);
U.S. Cl.
CPC ...
H04N 5/374 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/14643 (2013.01); H04N 5/341 (2013.01);
Abstract
Provided is a solid-state imaging device that includes a first substrate that has one principal surface on which a pixel portion in which pixels are arranged is formed, a second substrate which is bonded to a surface of the first substrate opposed to the one principal surface and in which an opening is provided in a partial region in a surface opposed to a bonding surface to the first substrate is provided. The solid-state imaging device further includes at least one sub-chip inside the opening so as not to protrude from the opening and in which a circuit having a predetermined function is formed.