The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

Sep. 02, 2021
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Ho Kyung Kang, Suwon-si, KR;

Gil Ha Lee, Suwon-si, KR;

Shin Haeng Heo, Suwon-si, KR;

Hyung Ho Seo, Suwon-si, KR;

Hong Cheol Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 21/06 (2006.01); H01Q 1/22 (2006.01); H01Q 21/00 (2006.01); H01Q 9/04 (2006.01); H01Q 1/02 (2006.01); H01Q 1/24 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/065 (2013.01); H01Q 1/02 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/045 (2013.01); H01Q 21/0025 (2013.01); H01Q 21/0087 (2013.01); H01Q 1/243 (2013.01);
Abstract

An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.


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