The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

Aug. 30, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Yann Mignot, Slingerlands, NY (US);

Hsueh-Chung Chen, Cohoes, NY (US);

Junli Wang, Slingerlands, NY (US);

Mary Claire Silvestre, Clifton Park, NY (US);

Chi-Chun Liu, Altamont, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 28/90 (2013.01);
Abstract

Structures are provided that include a metal-insulator-metal capacitor (MIMCAP) present in the back-end-of-the-line (BEOL). The MIMCAP includes at least one of the bottom electrode and the top electrode having a via portion and a base portion that is formed utilizing a subtractive via etch process. Less via over etching occurs resulting in improved critical dimension control of the bottom and/or top electrodes that are formed by the subtractive via etch process. No bottom liner is present in the MIMCAP thus improving the resistance/capacitance of the device. Also, and in some embodiments, a reduced foot-print area is possible to bring the via portion of the bottom electrode closer to the top electrode.


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