The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Aug. 28, 2020
Applicant:
Vanguard International Semiconductor Corporation, Hsinchu, TW;
Inventor:
Chih-Yen Chen, Tainan, TW;
Assignee:
Vanguard International Semiconductor Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 29/20 (2006.01); H01L 29/205 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0243 (2013.01); H01L 21/0254 (2013.01); H01L 21/02458 (2013.01); H01L 21/02502 (2013.01); H01L 21/02505 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 21/0242 (2013.01); H01L 21/02378 (2013.01); H01L 21/02389 (2013.01); H01L 21/02455 (2013.01); H01L 21/02488 (2013.01); H01L 21/02513 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01);
Abstract
A semiconductor substrate is provided. The semiconductor substrate includes a ceramic base, a seed layer, and a nucleation layer. The ceramic base has a front surface and a back surface, and the front surface is a non-flat surface. The seed layer is disposed on the front surface of the ceramic substrate. The nucleation layer is disposed on the seed layer.