The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Mar. 29, 2021
Taiyo Yuden Co., Ltd., Tokyo, JP;
Keisuke Ishii, Tokyo, JP;
TAIYO YUDEN CO., LTD., Tokyo, JP;
Abstract
A ceramic electronic component includes a multilayer chip including a multilayer structure, which includes ceramic dielectric layers and internal electrode layers that are alternately stacked, and cover layers respectively disposed on top and bottom faces of the multilayer structure in a first direction in which the dielectric layers and the internal electrode layers are alternately stacked, wherein each of the cover layers includes a relatively high porous section and a first relatively less porous section having a pore ratio less than a pore ratio of the relatively high porous section, the relatively high porous section laterally spreading and spanning an entire length of the cover layer in a second direction orthogonal to the first direction, the pore ratio of the relatively high porous section being 1% or greater, the first relatively less porous section being interposed between the relatively high porous section and the multilayer structure.