The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Sep. 16, 2019
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventor:
Katsuyuki Horie, Takasaki, JP;
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01F 27/28 (2006.01); H01F 27/24 (2006.01); H01F 17/04 (2006.01); H01F 27/26 (2006.01); H01F 3/10 (2006.01); H01F 41/02 (2006.01);
U.S. Cl.
CPC ...
H01F 17/045 (2013.01); H01F 3/10 (2013.01); H01F 27/263 (2013.01); H01F 27/266 (2013.01); H01F 27/2823 (2013.01); H01F 27/292 (2013.01); H01F 41/0246 (2013.01); H01F 2017/0093 (2013.01);
Abstract
A coil component includes: a first substrate body and a second substrate body, both formed in a manner containing a magnetic material; an adhesive containing an organic material and a filler, for bonding the first substrate body and the second substrate body; a coil formed by a conductor having an insulating film; and electrodes connected electrically to the coil; wherein the surface roughness of the face of the first substrate body bonded to the second substrate body via the adhesive is higher than the average grain size of the filler.