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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11670434 B1

PDFFull Text
Date of Patent:
Jun. 06, 2023

Filed:

Mar. 07, 2022

Wiring harness assembly having multiple separated conductors embedded within a substrate

Applicant:

Aptiv Technologies Limited, St. Michael, BB;

Inventors:

Jared Bilas, North Bloomfield, OH (US);

David R. Peterson, Aurora, OH (US);

Kurt P. Seifert, Cortland, OH (US);

Christopher G. Reider, Canfield, OH (US);

Doyeon Y. Sohn, Birmingham, MI (US);

Gerald A. Rhinehart, Jr., Lordstown, OH (US);

Therese G. Stevens, Warren, OH (US);

George A. Drew, Warren, OH (US);

John T. Kightlinger, Canfield, OH (US);

Assignee:

APTIV TECHNOLOGIES LIMITED, St Michael, BB;

Attorney:

Billion & Armitage

Primary Examiner:

Briggitte R Hammond

Int. Cl.
CPC ...
H01B 7/00 (2006.01); H01B 7/02 (2006.01); H01B 13/00 (2006.01); H01B 13/012 (2006.01); H01B 13/24 (2006.01); H01B 7/36 (2006.01); H01B 7/40 (2006.01); H01R 27/02 (2006.01); H01R 13/502 (2006.01); H01R 12/67 (2011.01); B60R 16/02 (2006.01); B33Y 80/00 (2015.01); H01R 12/59 (2011.01); B29C 64/10 (2017.01); B29C 64/106 (2017.01); B33Y 10/00 (2015.01); H05K 3/00 (2006.01); B33Y 30/00 (2015.01); H01R 13/52 (2006.01);
U.S. Cl.
CPC ...
H01B 7/0045 (2013.01); B29C 64/10 (2017.08); B29C 64/106 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 80/00 (2014.12); B60R 16/0207 (2013.01); H01B 7/009 (2013.01); H01B 7/0275 (2013.01); H01B 7/363 (2013.01); H01B 7/40 (2013.01); H01B 13/0013 (2013.01); H01B 13/01209 (2013.01); H01B 13/01236 (2013.01); H01B 13/01263 (2013.01); H01B 13/24 (2013.01); H01R 12/592 (2013.01); H01R 12/675 (2013.01); H01R 13/502 (2013.01); H01R 27/02 (2013.01); H05K 3/00 (2013.01); H01B 13/01254 (2013.01); H01R 13/5202 (2013.01); H01R 13/5205 (2013.01); H01R 2201/26 (2013.01);
Abstract

A method of manufacturing a wiring harness assembly includes the steps of forming a plurality of electrically conductive wires encased within a substrate formed of a dielectric material, forming an opening in the substrate located and sized such that a section of the plurality of electrically conductive wires is exposed within the opening, disposing a support segment within the opening, securing a connector segment including a plurality of terminals to the support segment, and placing the plurality of terminals in mechanical and electrical contact with the plurality of electrically conductive wires.

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