The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

Aug. 14, 2020
Applicant:

View, Inc., Milpitas, CA (US);

Inventors:

Robert T. Rozbicki, Los Gatos, CA (US);

Sridhar Karthik Kailasam, Fremont, CA (US);

Robin Friedman, Sunnyvale, CA (US);

Dane Thomas Gillaspie, Fremont, CA (US);

Anshu A. Pradhan, Collierville, TN (US);

Disha Mehtani, Mountain View, CA (US);

Assignee:

View, Inc., Milpitas, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/15 (2019.01); G02F 1/1524 (2019.01); G02F 1/1523 (2019.01); G02F 1/155 (2006.01); H01B 5/14 (2006.01); H01B 13/00 (2006.01); G02F 1/1333 (2006.01); G02F 1/153 (2006.01); C23C 14/34 (2006.01); C23C 14/02 (2006.01); C23C 14/06 (2006.01); C23C 14/08 (2006.01); G02F 1/13 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
G02F 1/15 (2013.01); C23C 14/028 (2013.01); C23C 14/06 (2013.01); C23C 14/0635 (2013.01); C23C 14/0641 (2013.01); C23C 14/0652 (2013.01); C23C 14/0676 (2013.01); C23C 14/08 (2013.01); C23C 14/081 (2013.01); C23C 14/083 (2013.01); C23C 14/086 (2013.01); C23C 14/34 (2013.01); G02F 1/1309 (2013.01); G02F 1/133345 (2013.01); G02F 1/155 (2013.01); G02F 1/1523 (2013.01); G02F 1/1524 (2019.01); G02F 1/1533 (2013.01); H01B 5/14 (2013.01); H01B 13/00 (2013.01); H01J 37/3429 (2013.01); H01J 37/3476 (2013.01); G02F 2001/1536 (2013.01); G02F 2001/1555 (2013.01); G02F 2201/508 (2013.01);
Abstract

Electrochromic devices and methods may employ the addition of a defect-mitigating insulating layer which prevents electronically conducting layers and/or electrochromically active layers from contacting layers of the opposite polarity and creating a short circuit in regions where defects form. In some embodiments, an encapsulating layer is provided to encapsulate particles and prevent them from ejecting from the device stack and risking a short circuit when subsequent layers are deposited. The insulating layer may have an electronic resistivity of between about 1 and 10Ohm-cm. In some embodiments, the insulating layer contains one or more of the following metal oxides: aluminum oxide, zinc oxide, tin oxide, silicon aluminum oxide, cerium oxide, tungsten oxide, nickel tungsten oxide, and oxidized indium tin oxide. Carbides, nitrides, oxynitrides, and oxycarbides may also be used.


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