The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

May. 17, 2019
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Peter F. Coxeter, Sunnyvale, CA (US);

Didio V. Gomes, Sunnyvale, CA (US);

Benjamin J. Grena, Sunnyvale, CA (US);

Steven J. Keating, Sunnyvale, CA (US);

David M. Kindlon, Felton, CA (US);

Maurice P. May, Sunnyvale, CA (US);

Daniel A. Podhajny, San Jose, CA (US);

Andrew L. Rosenberg, Sunnyvale, CA (US);

Daniel D. Sunshine, Sunnyvale, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
D03D 1/00 (2006.01); D02G 3/44 (2006.01); H05K 1/03 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
D03D 1/0088 (2013.01); D02G 3/441 (2013.01); H05K 1/038 (2013.01); H05K 3/34 (2013.01); H05K 2201/029 (2013.01);
Abstract

A fabric-based item may include fabric formed from intertwined strands of material. The fabric may include first and second fabric layers that at least partially surround a pocket. Initially, the pocket may be completely enclosed by the first and second layers of fabric. A shim may be placed in the pocket before the pocket is closed. An opening may be formed in the first layer of fabric to expose a conductive strand in the pocket. The shim may prevent the cutting tool from cutting all the way through to the second layer of fabric. After cutting the hole in the first layer of fabric, the shim may be removed and an electrical component may be soldered to the conductive strand in the pocket. A polymer material may be injected into the pocket to encapsulate the electrical component. The polymer material may interlock with the surrounding pocket walls.


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