The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

Oct. 02, 2019
Applicant:

Fuji Polymer Industries Co., Ltd., Nagoya, JP;

Inventor:

Hitoshi Shibuya, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08J 5/18 (2006.01); C08K 3/22 (2006.01); C08K 7/18 (2006.01); C08K 9/06 (2006.01); H01L 23/373 (2006.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08J 5/18 (2013.01); C08K 3/22 (2013.01); C08K 7/18 (2013.01); C08K 9/06 (2013.01); C08J 2383/04 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); H01L 23/3737 (2013.01); H01L 33/641 (2013.01);
Abstract

A thermally conductive sheet contains a matrix resin and thermally conductive particles. The content of the thermally conductive particles is 200 parts by volume or more with respect to 100 parts by volume of the matrix resin component. A polymer viscosity of the matrix resin component after a crosslinking reaction in the absence of the thermally conductive particles is 500 Pa·s or less at 25° C. A thermal conductivity of the thermally conductive sheet is 2.0 W/m·K or more. When the thermally conductive sheet with an initial thickness of 1.5 mm is compressed at a compression rate of 5.0 mm/min to measure a 50% compressive load value, the maximum load value is 100 kPa or more and the load value after 1 minute is more than 0 kPa and 100 kPa or less. With this configuration, the thermally conductive sheet has a high thermal conductivity, a low steady load value, and flexibility.


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Shibuya, Hitoshi. (2023). Thermally conductive sheet and method for producing the same (U.S. Patent No. 11667825). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11667825

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