The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Dec. 29, 2021
Applicant:
Zephyros, Inc., Romeo, MI (US);
Inventor:
Michael Czaplicki, Leonard, MI (US);
Assignee:
Zephyros, Inc., Romeo, MI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 5/06 (2006.01); C08G 59/18 (2006.01); C09J 163/00 (2006.01); C09J 171/00 (2006.01); C08L 71/00 (2006.01); C09J 11/04 (2006.01); C09J 11/08 (2006.01); C08L 71/12 (2006.01); C08L 63/00 (2006.01); C08K 3/26 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
C09J 5/06 (2013.01); C08G 59/186 (2013.01); C09J 163/00 (2013.01); C09J 171/00 (2013.01); C08G 2650/56 (2013.01); C08L 71/00 (2013.01); C08L 2666/02 (2013.01); C08L 2666/22 (2013.01); C09J 2400/163 (2013.01);
Abstract
An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.