The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

May. 12, 2020
Applicant:

Subaru Corporation, Tokyo, JP;

Inventors:

Naoyuki Sekine, Tokyo, JP;

Keisuke Hamada, Tokyo, JP;

Assignee:

SUBARU CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/08 (2006.01); B32B 27/34 (2006.01); B29C 70/08 (2006.01); B29K 77/00 (2006.01); B29K 105/08 (2006.01); B29K 277/00 (2006.01);
U.S. Cl.
CPC ...
B32B 5/08 (2013.01); B29C 70/08 (2013.01); B32B 27/34 (2013.01); B29K 2077/00 (2013.01); B29K 2105/0872 (2013.01); B29K 2277/00 (2013.01); B29K 2995/0077 (2013.01); B32B 2262/0261 (2013.01); B32B 2307/54 (2013.01);
Abstract

A preform includes a stack of a plurality of fiber materials. The fiber materials each include a first fiber layer including a reinforcing fiber and having a sheet shape, in which the reinforcing fiber has a melting point and a tensile strength that are higher than a melting point and a tensile strength of an aliphatic polyamide fiber, and a second fiber layer including the aliphatic polyamide fiber and having a sheet shape, and provided on at least one of surfaces of the first fiber layer. The aliphatic polyamide fiber includes a first polyamide resin and a second polyamide resin having a melting point higher than a melting point of the first polyamide resin by 7 degrees centigrade to 50 degrees centigrade.


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