The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Apr. 11, 2019
Applicant:
Us Synthetic Corporation, Orem, UT (US);
Inventor:
David P. Miess, Highland, UT (US);
Assignee:
US SYNTHETIC CORPORATION, Orem, UT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 3/02 (2006.01); B24D 18/00 (2006.01); B23C 5/10 (2006.01); B22F 5/08 (2006.01); B24D 99/00 (2010.01); C22C 26/00 (2006.01); B22F 7/06 (2006.01); B22F 3/14 (2006.01); B23G 5/06 (2006.01); E21B 10/573 (2006.01); B24D 3/00 (2006.01); B24D 11/00 (2006.01); B22F 5/00 (2006.01); B23B 51/00 (2006.01);
U.S. Cl.
CPC ...
B24D 18/0009 (2013.01); B22F 3/14 (2013.01); B22F 5/085 (2013.01); B22F 7/06 (2013.01); B23C 5/10 (2013.01); B23G 5/06 (2013.01); B24D 99/005 (2013.01); C22C 26/00 (2013.01); E21B 10/573 (2013.01); B22F 2005/001 (2013.01); B23B 51/00 (2013.01); B23B 2226/315 (2013.01); B23C 2226/315 (2013.01); B23G 2225/165 (2013.01);
Abstract
Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.