The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Mar. 06, 2020
Applicant:
Funai Electric Co., Ltd., Osaka, JP;
Inventors:
David L. Bernard, Lexington, KY (US);
Sean T. Weaver, Florence, KY (US);
Assignee:
FUNAI ELECTRIC CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/52 (2013.01); B01L 3/502707 (2013.01); B01L 2200/12 (2013.01); B01L 2200/16 (2013.01); B01L 2300/06 (2013.01); B01L 2300/0819 (2013.01); B01L 2300/0858 (2013.01); B01L 2300/12 (2013.01);
Abstract
A microfluidic ejection chip includes a silicon substrate having a fluid passageway. The fluid passageway is defined by a silicon sidewall of the silicon substrate that is covered by a permanent passivation layer to protect the silicon sidewall from exposure to an acidic fluid. The permanent passivation layer is retained on the silicon sidewall at a conclusion of etching of the silicon substrate to form the fluid passageway.