The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Apr. 13, 2017
Applicant:
Medtronic, Inc., Minneapolis, MN (US);
Inventors:
Darren Janzig, Center City, MN (US);
Robert J. Davies, Mounds View, MN (US);
Seth M. Humphrys, Golden Valley, MN (US);
Richard T. Stone, Minneapolis, MN (US);
Assignee:
Medtronic, Inc., Minneapolis, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/375 (2006.01); B23K 26/21 (2014.01); A61N 1/05 (2006.01); B23K 15/00 (2006.01); B23K 101/36 (2006.01); A61N 1/36 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3752 (2013.01); A61N 1/05 (2013.01); B23K 15/0046 (2013.01); B23K 26/21 (2015.10); A61N 1/0551 (2013.01); A61N 1/3605 (2013.01); B23K 2101/36 (2018.08);
Abstract
A method of forming a medical device lead connection element is described. The method includes positioning an end portion of a lead filar to overlap a lead end connection element such that the positioning creates mutual interference between the lead filar and the lead end connection element, and forming an interference configuration. Then melting the end portion of the lead filar to form a weld joint and allowint the end portion of the lead filar to move towards the end connection element.