The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

Aug. 16, 2017
Applicant:

University of Virginia Patent Foundation, Charlottesville, VA (US);

Inventors:

Cheng Yang, Charlottesville, VA (US);

B. Jill Venton, Charlottesville, VA (US);

Elefterios Trikantzopoulos, Richmond, VA (US);

Assignee:

University of Virginia Patent Foundation, Charlottesville, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/291 (2021.01); A61B 5/283 (2021.01); H01B 3/30 (2006.01); H01B 1/24 (2006.01); A61B 5/24 (2021.01); H01B 1/02 (2006.01); H01B 1/04 (2006.01); H01B 5/14 (2006.01);
U.S. Cl.
CPC ...
A61B 5/283 (2021.01); A61B 5/24 (2021.01); A61B 5/291 (2021.01); H01B 1/24 (2013.01); H01B 3/306 (2013.01); H01B 3/307 (2013.01); A61B 2562/028 (2013.01); A61B 2562/125 (2013.01); H01B 1/02 (2013.01); H01B 1/04 (2013.01); H01B 5/14 (2013.01);
Abstract

A method for preparing microsensors (e.g., microelectrodes) suitable for use in electrophysiology and electrochemistry studies in vitro and in vivo is described. The method can involve preparing a polymeric resin-insulated electron conducting fiber using a 3D printed mold comprising one or more channels, wherein each of the channels includes a tapered section. An electron conducting fiber partially enclosed within a metal or glass support can be laid in a channel; and a polymeric resin can be poured into the channel and cured, providing a polymer-insulated electron conducting fiber having a tapered section in proximity to a polymer-free electroactive tip area. For example, the method can be used to provide a polyimide-insulated carbon fiber microsensor. The mold can be used for the batch fabrication of the microsensors. The microsensors themselves, the molds for making the microsensors, and methods of using the microsensors are also described.


Find Patent Forward Citations

Yang, Cheng. (2023). Three dimensional printed mold for electrochemical sensor fabrication, method and related system and devices thereof (U.S. Patent No. 11666263). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11666263

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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