The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
Oct. 26, 2021
Applicant:
Eagle Technology, Llc, Melbourne, FL (US);
Inventors:
Assignee:
EAGLE TECHNOLOGY, LLC, Melbourne, FL (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 7/14 (2006.01); H01L 23/373 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H05K 7/1454 (2013.01); H05K 7/20263 (2013.01); H05K 7/20272 (2013.01); H01L 23/3733 (2013.01); H01L 23/3736 (2013.01); H01L 23/4275 (2013.01);
Abstract
An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.