The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Sep. 22, 2020
Applicants:

Hongqisheng Precision Electronics (Qinhuangdao) Co.,ltd., Qinhuangdao, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Inventors:

Jian Wang, Qinhuangdao, CN;

Mei Yang, Qinhuangdao, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 3/00 (2006.01); H05K 3/24 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 3/305 (2013.01); H05K 3/0017 (2013.01); H05K 3/241 (2013.01); H05K 3/321 (2013.01); H05K 2201/10651 (2013.01);
Abstract

A method for manufacturing a circuit board with nickel resistor embedded therein provides a copper substrate, the copper substrate includes a copper foil. A nickel resistance layer is formed on the copper foil. A first dielectric layer and a first copper layer are formed on the nickel resistance layer. The copper foil and the first copper layer are etched to form a first conductive wiring layer and a second conductive wiring layer respectively, the nickel layer not being subjected to an etching process, to obtain the finished circuit board.


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