The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Nov. 29, 2021
Applicants:

Qing Ding Precision Electronics (Huaian) Co.,ltd, Huai an, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Inventors:

Man-Zhi Peng, Huaian, CN;

Rui-Wu Liu, Huaian, CN;

Ming-Jaan Ho, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 3/14 (2006.01); H01L 23/13 (2006.01); H01L 23/60 (2006.01); H01L 23/488 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/112 (2013.01); H05K 3/0014 (2013.01); H05K 3/0052 (2013.01); H05K 1/119 (2013.01); H05K 3/0029 (2013.01); H05K 3/0038 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09672 (2013.01); H05K 2203/0169 (2013.01);
Abstract

Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.


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