The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
Sep. 28, 2021
Applicant:
Upbeat Technology Co., Ltd, New Taipei, TW;
Inventor:
Hsien-Lung Ho, New Taipei, TW;
Assignee:
UPBEAT TECHNOLOGY CO., LTD, New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H04R 7/04 (2006.01); H04R 7/18 (2006.01); H04R 1/04 (2006.01); H04R 31/00 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 3/007 (2013.01); B81C 1/00658 (2013.01); H04R 1/04 (2013.01); H04R 7/04 (2013.01); H04R 7/18 (2013.01); H04R 31/003 (2013.01); H04R 31/006 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/019 (2013.01); B81B 2203/0127 (2013.01); H04R 2201/003 (2013.01);
Abstract
A MEMS acoustic sensor includes a substrate, a back plate, a diaphragm, a dielectric layer and a connecting portion. The diaphragm is disposed between the substrate and the back plate and includes a vibration portion. The dielectric layer is formed between the substrate and the diaphragm and has a cavity corresponding to the vibrating portion. The connecting portion is located in the cavity and connects the vibrating portion and the substrate.