The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
Nov. 05, 2020
Applicant:
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
Inventors:
Karine Saxod, Les Marches, FR;
Nicolas Mastromauro, Lumbin, FR;
Assignee:
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/14 (2006.01); G01S 7/484 (2006.01); G01S 7/4865 (2020.01); H01L 31/0203 (2014.01); H01L 33/52 (2010.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 31/143 (2013.01); G01S 7/484 (2013.01); G01S 7/4865 (2013.01); H01L 31/0203 (2013.01); H01L 31/18 (2013.01); H01L 33/005 (2013.01); H01L 33/52 (2013.01); H01L 2933/005 (2013.01);
Abstract
A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the cover and the carrier substrate make contact. At least one adhesive bead is located elsewhere than the seating surface in order to securely fasten the encapsulation cover and the carrier substrate.