The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Apr. 05, 2019
Applicant:

Sunpower Corporation, San Jose, CA (US);

Inventors:

Pei Hsuan Lu, San Jose, CA (US);

Benjamin I. Hsia, Fremont, CA (US);

David Aaron Randolph Barkhouse, Oakland, CA (US);

Lewis C. Abra, San Francisco, CA (US);

George G. Correos, Corralitos, CA (US);

Marc Robinson, Cedar Park, TX (US);

Paul W. Loscutoff, Castro Valley, CA (US);

Ryan Reagan, Hayward, CA (US);

David Okawa, Redwood City, CA (US);

Tamir Lance, Los Gatos, CA (US);

Thierry Nguyen, San Francisco, CA (US);

Assignee:

Maxeon Solar Pte. Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/05 (2014.01); H01L 31/0224 (2006.01); H01L 31/0465 (2014.01); H01L 31/0475 (2014.01); H01L 31/049 (2014.01);
U.S. Cl.
CPC ...
H01L 31/0465 (2014.12); H01L 31/022433 (2013.01); H01L 31/049 (2014.12); H01L 31/0475 (2014.12); H01L 31/0508 (2013.01);
Abstract

Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.


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