The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Aug. 10, 2020
Applicant:

Toshiba Hokuto Electronics Corporation, Asahikawa, JP;

Inventors:

Kairi Makita, Asahikawa, JP;

Fumio Ueno, Tokyo, JP;

Assignee:

NICHIA CORPORATION, Tokushima, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01R 12/61 (2011.01); H01R 4/04 (2006.01); H01R 43/00 (2006.01); C09J 9/02 (2006.01); C09J 5/06 (2006.01); H01L 33/48 (2010.01); C09J 127/12 (2006.01); H01L 33/56 (2010.01); H01R 4/70 (2006.01); C08K 9/10 (2006.01); C08K 7/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); C09J 5/06 (2013.01); C09J 9/02 (2013.01); C09J 127/12 (2013.01); H01L 33/483 (2013.01); H01L 33/62 (2013.01); H01R 4/04 (2013.01); H01R 12/61 (2013.01); H01R 43/00 (2013.01); C08K 7/18 (2013.01); C08K 9/10 (2013.01); C08K 2201/001 (2013.01); C08K 2201/013 (2013.01); H01L 33/56 (2013.01); H01R 4/70 (2013.01);
Abstract

A light-emitting device according to an embodiment is provided with: a light-emitting panel including a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; and a flexible wiring board including a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board.


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