The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
Mar. 12, 2021
Infineon Technologies Austria Ag, Villach, AT;
Rabie Djemour, Munich, DE;
Muhammad Khairullah Nor Azmi, Kedah, MY;
Infineon Technologies Austria AG, Villach, AT;
Abstract
A semiconductor device includes a semiconductor package including an encapsulant body of electrically insulating encapsulant material, a semiconductor die encapsulated by the encapsulant body, and two or more leads that are each electrically connected to the semiconductor die, and an ESD protection element that is electrically connected between the two or more leads, and the ESD protection element is configured to be electrically disconnected from the two or more leads by an external stimulus applied to ESD protection element that is non-destructive to the semiconductor package.