The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
Jul. 27, 2020
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Paul Merle Emerson, Murphy, TX (US);
Benjamin Stassen Cook, Addison, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 27/02 (2006.01); H01L 21/66 (2006.01); H01L 23/522 (2006.01); H01L 21/78 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76838 (2013.01); H01L 21/76801 (2013.01); H01L 21/78 (2013.01); H01L 22/12 (2013.01); H01L 22/14 (2013.01); H01L 23/5223 (2013.01); H01L 23/5227 (2013.01); H01L 23/5228 (2013.01); H01L 27/0207 (2013.01);
Abstract
An integrated circuit includes a semiconductor substrate and a metallization structure over the semiconductor substrate. The metallization structure includes: a dielectric layer having a surface; a conductive routing structure; and an electronic circuit. Over the surface of the dielectric layer, a material is configured to set or adjust the electronic circuit.