The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
Jul. 19, 2021
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Eun Hee Jeong, Suwon-si, KR;
Do Young Jeong, Suwon-si, KR;
Dong Hwi Shin, Suwon-si, KR;
Hyung Duk Yun, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes; a first external electrode including a first electrode layer connected to the first internal electrodes, a first conductive resin layer on the first electrode layer, and a first plating layer on the first conductive resin layer, and including a first connection portion on a third surface of the body and a first band portion extending on first and second surfaces of the body; and a second external electrode connected to the second internal electrodes. L-Lis greater than 10 μm in which Lis a distance from the third surface to a distal end of the first conductive resin layer in the first band portion, and Lis a distance from the third surface to a distal end of the first plating layer in the first band portion.