The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Apr. 29, 2022
Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

Kuo-Wei Tseng, Zhongzheng Dist., TW;

Hong-Ji Huang, Kinyi Dist., TW;

Yu-Chen Liu, Hsinchu, TW;

Chun-Wei Huang, East Dist., TW;

Chi-Fong Lee, Taoyuan, TW;

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G02F 1/1335 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); G02F 1/13338 (2013.01); G02F 1/133528 (2013.01); H10K 50/86 (2023.02); H10K 59/126 (2023.02); H10K 59/40 (2023.02);
Abstract

An information handling system presents visual images at a display that includes a display panel having a capacitive touch detection surface supported by an indium tin oxide layer disposed between a front layer, such as polarizer, and a display cell. To prevent excessive charge build up associated with the capacitive touch detection surface, a conductive ink is applied at the display panel perimeter and interfaced with a ground at the rear side of the display panel. In one example embodiment, a non-conductive ink insulates the conductive ink from the display panel except as desired to transfer excess charge from the indium tin oxide layer. The conductive ink may interface directly with the indium tin oxide layer or indirectly through a second non-conductive ink having greater conductivity than the insulative non-conductive ink.


Find Patent Forward Citations

Loading…