The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Jan. 10, 2020
Applicant:

Te Connectivity Solutions Gmbh, Steinach, CH;

Inventors:

Ismael Brunner, Steinach, CH;

Thomas Arnold, Steinach, CH;

Predrag Drljaca, Steinach, CH;

Assignee:

TE Connectivity Solutions GmbH, Schaffhausen, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); G01L 7/00 (2006.01); B81B 3/00 (2006.01); G01L 7/08 (2006.01);
U.S. Cl.
CPC ...
G01L 7/08 (2013.01); B81B 3/0064 (2013.01); G01L 9/0019 (2013.01); G01L 9/0042 (2013.01); B81B 2201/0264 (2013.01);
Abstract

A sensor unit includes a transducer element monitoring a measurand and generating an electrical output signal correlated with the measurand, a sensor substrate having a first surface and an opposite second surface, a recess extending from the first surface of the substrate through to the second surface of the substrate, and a circuit carrier. The transducer element and a first electrically conductive contact pad are arranged on the first surface and electrically connected. The circuit carrier has a second electrically conductive contact pad. The sensor substrate is mounted on the circuit carrier with the first surface facing the circuit carrier. The first electrically conductive contact pad and the second electrically conductive contact pad are interconnected by an electrically conductive material filled in from the second surface towards the first surface of the sensor substrate.


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