The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Jun. 12, 2019
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Masanori Jinnoh, Kariya, JP;

Aun Ota, Kariya, JP;

Hisayoshi Oshima, Kariya, JP;

Hidehiko Hiramatsu, Kariya, JP;

Takashi Kaneko, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 13/00 (2006.01); F28F 13/14 (2006.01);
U.S. Cl.
CPC ...
F28F 13/00 (2013.01); F28F 13/14 (2013.01); F28F 2013/001 (2013.01); F28F 2013/006 (2013.01); F28F 2013/008 (2013.01);
Abstract

A heat conduction device includes a heat source portion, a temperature control surface, and heat transfer portions. The heat source portion is configured to generate at least hot heat or cold heat. The temperature control surface is sectioned into a plurality of temperature control sections, and at least some of the plurality of temperature control sections are disposed away from the heat source portion. The plurality of heat transfer portions connect the heat source portion and the plurality of the temperature control sections to transfer heat between the heat source portion and the plurality of temperature control sections. The plurality of temperature control sections are separated from each other based on a distance from the heat source portion.


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